According to the research report, the global advancedpackaging market size is expected to touch USD 52.75 Billion by 2030, from USD 28.18 Billion in 2022, growing with a significant CAGR of 8.1 % from 2022 to 2030.
The advanced packaging report offers a
comprehensive study of the current state expected at the major drivers, market
strategies, and key vendors’ growth. The report presents energetic visions to
conclude and study the market size, market hopes, and competitive surroundings.
The research also focuses on the important achievements of the market, research
& development, and regional growth of the leading competitors operating in
the market. The current trends of the global advanced packaging in conjunction
with the geographical landscape of this vertical have also been included in
this report.
The report offers intricate dynamics about
different aspects of the global advanced packaging market, which aids companies
operating in the market in making strategic development decisions. The study
also elaborates on significant changes that are highly anticipated to configure
growth of the global advanced packaging during the forecast period. It also
includes a key indicator assessment that highlights growth prospects of this
market and estimates statistics related to growth of the market in terms of
value (US$ Mn) and volume (tons).
Sample
Link @ https://www.precedenceresearch.com/sample/1337
| Report Highlights | Details |
| Market Size | USD 52.75 Billion by 2030 |
| Growth Rate | CAGR of 8.1% from 2021 to 2030 |
| Largest Market | Asia Pacific |
| Fastest Growing Market | North America |
| Base Year | 2021 |
| Fofrecast Period | 2021 to 2030 |
This study covers a detailed segmentation
of the global advanced packaging market, along with key information and a
competition outlook. The report mentions company profiles of players that are
currently dominating the global advanced packaging market, wherein various
developments, expansions, and winning strategies practiced and implemented by
leading players have been presented in detail.
Key Players are Amkor Technology Inc., ASE Technology Holding Co. Ltd., China Wafer Level CSP Co., Ltd., ChipMOS Technologies, Inc., FlipChip International LLC, HANA Micron Inc., Jiangsu Changjiang Electronics Technology Co., Ltd
Market SegmentationBy Type
- Flip Chip CSP
- Flip-Chip Ball Grid Array
- Wafer Level CSP
- 5D/3D
- Fan Out WLP
- Others
By End-use
- Consumer Electronics
- Automotive
- Industrial
- Healthcare
- Aerospace & Defense
- Others
By Geography
- North America
- U.S.
- Canada
- Mexico
- Europe
- U.K.
- Germany
- France
- Russia
- Italy
- Spain
- Rest of Europe
- Asia Pacific
- China
- India
- Japan
- South Korea
- Rest of Asia-Pacific
- LAMEA
- Latin America
- Middle East
- Africa
Research Methodology
The research methodology adopted by
analysts for compiling the global advanced packaging report is based on
detailed primary as well as secondary research. With the help of in-depth
insights of the market-affiliated information that is obtained and legitimated
by market-admissible resources, analysts have offered riveting observations and
authentic forecasts for the global market.
During the primary research phase, analysts
interviewed market stakeholders, investors, brand managers, vice presidents,
and sales and marketing managers. Based on data obtained through interviews of
genuine resources, analysts have emphasized the changing scenario of the global
market.
For secondary research, analysts
scrutinized numerous annual report publications, white papers, market
association publications, and company websites to obtain the necessary understanding
of the global advanced packaging market.
TABLE OF CONTENT
Chapter 1. Introduction
1.1. Research Objective
1.2. Scope of the Study
1.3. Definition
Chapter 2. Research Methodology
2.1. Research Approach
2.2. Data Sources
2.3. Assumptions & Limitations
Chapter 3. Executive Summary
3.1. Market Snapshot
Chapter 4. Market Variables and Scope
4.1. Introduction
4.2. Market Classification and Scope
4.3. Industry Value Chain Analysis
4.3.1. Raw Material Procurement Analysis
4.3.2. Sales and Distribution Channel Analysis
4.3.3. Downstream Buyer Analysis
Chapter 5. COVID 19 Impact on Advanced Packaging Market
5.1. COVID-19 Landscape: Advanced Packaging Industry Impact
5.2. COVID 19 - Impact Assessment for the Industry
5.3. COVID 19 Impact: Global Major Government Policy
5.4. Market Trends and Opportunities in the COVID-19 Landscape
Chapter 6. Market Dynamics Analysis and Trends
6.1. Market Dynamics
6.1.1. Market Drivers
6.1.2. Market Restraints
6.1.3. Market Opportunities
6.2. Porter’s Five Forces Analysis
6.2.1. Bargaining power of suppliers
6.2.2. Bargaining power of buyers
6.2.3. Threat of substitute
6.2.4. Threat of new entrants
6.2.5. Degree of competition
Chapter 7. Competitive Landscape
7.1.1. Company Market Share/Positioning Analysis
7.1.2. Key Strategies Adopted by Players
7.1.3. Vendor Landscape
7.1.3.1. List of Suppliers
7.1.3.2. List of Buyers
Chapter 8. Global Advanced Packaging Market, By Product
8.1. Advanced Packaging Market, by Product Type, 2021-2030
8.1.1. Flip Chip CSP
8.1.1.1. Market Revenue and Forecast (2019-2030)
8.1.2. Flip-Chip Ball Grid Array
8.1.2.1. Market Revenue and Forecast (2019-2030)
8.1.3. Wafer Level CSP
8.1.3.1. Market Revenue and Forecast (2019-2030)
8.1.4. 5D/3D
8.1.4.1. Market Revenue and Forecast (2019-2030)
8.1.5. Fan Out WLP
8.1.5.1. Market Revenue and Forecast (2019-2030)
8.1.6. Others
8.1.6.1. Market Revenue and Forecast (2019-2030)
Chapter 9. Global Advanced Packaging Market, By End User
9.1. Advanced Packaging Market, by End User, 2021-2030
9.1.1. Consumer Electronics
9.1.1.1. Market Revenue and Forecast (2019-2030)
9.1.2. Automotive
9.1.2.1. Market Revenue and Forecast (2019-2030)
9.1.3. Industrial
9.1.3.1. Market Revenue and Forecast (2019-2030)
9.1.4. Healthcare
9.1.4.1. Market Revenue and Forecast (2019-2030)
9.1.5. Aerospace & Defense
9.1.5.1. Market Revenue and Forecast (2019-2030)
9.1.6. Others
9.1.6.1. Market Revenue and Forecast (2019-2030)
Chapter 10. Global Advanced Packaging Market, Regional Estimates and Trend Forecast
10.1. North America
10.1.1. Market Revenue and Forecast, by Product (2019-2030)
10.1.2. Market Revenue and Forecast, by End User (2019-2030)
10.1.3. U.S.
10.1.3.1. Market Revenue and Forecast, by Product (2019-2030)
10.1.3.2. Market Revenue and Forecast, by End User (2019-2030)
10.1.4. Rest of North America
10.1.4.1. Market Revenue and Forecast, by Product (2019-2030)
10.1.4.2. Market Revenue and Forecast, by End User (2019-2030)
10.2. Europe
10.2.1. Market Revenue and Forecast, by Product (2019-2030)
10.2.2. Market Revenue and Forecast, by End User (2019-2030)
10.2.3. UK
10.2.3.1. Market Revenue and Forecast, by Product (2019-2030)
10.2.3.2. Market Revenue and Forecast, by End User (2019-2030)
10.2.4. Germany
10.2.4.1. Market Revenue and Forecast, by Product (2019-2030)
10.2.4.2. Market Revenue and Forecast, by End User (2019-2030)
10.2.5. France
10.2.5.1. Market Revenue and Forecast, by Product (2019-2030)
10.2.5.2. Market Revenue and Forecast, by End User (2019-2030)
10.2.6. Rest of Europe
10.2.6.1. Market Revenue and Forecast, by Product (2019-2030)
10.2.6.2. Market Revenue and Forecast, by End User (2019-2030)
10.3. APAC
10.3.1. Market Revenue and Forecast, by Product (2019-2030)
10.3.2. Market Revenue and Forecast, by End User (2019-2030)
10.3.3. India
10.3.3.1. Market Revenue and Forecast, by Product (2019-2030)
10.3.3.2. Market Revenue and Forecast, by End User (2019-2030)
10.3.4. China
10.3.4.1. Market Revenue and Forecast, by Product (2019-2030)
10.3.4.2. Market Revenue and Forecast, by End User (2019-2030)
10.3.5. Japan
10.3.5.1. Market Revenue and Forecast, by Product (2019-2030)
10.3.5.2. Market Revenue and Forecast, by End User (2019-2030)
10.3.6. Rest of APAC
10.3.6.1. Market Revenue and Forecast, by Product (2019-2030)
10.3.6.2. Market Revenue and Forecast, by End User (2019-2030)
10.4. MEA
10.4.1. Market Revenue and Forecast, by Product (2019-2030)
10.4.2. Market Revenue and Forecast, by End User (2019-2030)
10.4.3. GCC
10.4.3.1. Market Revenue and Forecast, by Product (2019-2030)
10.4.3.2. Market Revenue and Forecast, by End User (2019-2030)
10.4.4. North Africa
10.4.4.1. Market Revenue and Forecast, by Product (2019-2030)
10.4.4.2. Market Revenue and Forecast, by End User (2019-2030)
10.4.5. South Africa
10.4.5.1. Market Revenue and Forecast, by Product (2019-2030)
10.4.5.2. Market Revenue and Forecast, by End User (2019-2030)
10.4.6. Rest of MEA
10.4.6.1. Market Revenue and Forecast, by Product (2019-2030)
10.4.6.2. Market Revenue and Forecast, by End User (2019-2030)
10.5. Latin America
10.5.1. Market Revenue and Forecast, by Product (2019-2030)
10.5.2. Market Revenue and Forecast, by End User (2019-2030)
10.5.3. Brazil
10.5.3.1. Market Revenue and Forecast, by Product (2019-2030)
10.5.3.2. Market Revenue and Forecast, by End User (2019-2030)
10.5.4. Rest of LATAM
10.5.4.1. Market Revenue and Forecast, by Product (2019-2030)
10.5.4.2. Market Revenue and Forecast, by End User (2019-2030)
Chapter 11. Company Profiles
11.1. Amkor Technology Inc.
11.1.1. Company Overview
11.1.2. Product Offerings
11.1.3. Financial Performance
11.1.4. Recent Initiatives
11.2. ASE Technology Holding Co. Ltd.
11.2.1. Company Overview
11.2.2. Product Offerings
11.2.3. Financial Performance
11.2.4. Recent Initiatives
11.3. China Wafer Level CSP Co., Ltd.
11.3.1. Company Overview
11.3.2. Product Offerings
11.3.3. Financial Performance
11.3.4. Recent Initiatives
11.4. ChipMOS Technologies, Inc.
11.4.1. Company Overview
11.4.2. Product Offerings
11.4.3. Financial Performance
11.4.4. Recent Initiatives
11.5. FlipChip International LLC
11.5.1. Company Overview
11.5.2. Product Offerings
11.5.3. Financial Performance
11.5.4. Recent Initiatives
11.6. HANA Micron Inc.
11.6.1. Company Overview
11.6.2. Product Offerings
11.6.3. Financial Performance
11.6.4. Recent Initiatives
11.7. Jiangsu Changjiang Electronics Technology Co., Ltd.
11.7.1. Company Overview
11.7.2. Product Offerings
11.7.3. Financial Performance
11.7.4. Recent Initiatives
11.8. King Yuan Electronics Corp. (KYEC)
11.8.1. Company Overview
11.8.2. Product Offerings
11.8.3. Financial Performance
11.8.4. Recent Initiatives
11.9. Nepes Corporation
11.9.1. Company Overview
11.9.2. Product Offerings
11.9.3. Financial Performance
11.9.4. Recent Initiatives
11.10. Powertech Technology, Inc.
11.10.1. Company Overview
11.10.2. Product Offerings
11.10.3. Financial Performance
11.10.4. Recent Initiatives
Chapter 12. Research Methodology
12.1. Primary Research
12.2. Secondary Research
12.3. Assumptions
Chapter 13. Appendix
13.1. About Us
13.2. Glossary of Terms
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